Brisbane, Queensland - Dec. 11, 2024 -Graphene Manufacturing Group Ltd. (TSXV: GMG) (OTCQX: GMGMF) ("GMG") is pleased to provide a business update on the commercialisation progress of THERMAL-XR®Powered by GMG Graphene.
CUSTOMER ENGAGEMENT UPDATEGMG continues to make progress in testing with companies in multiple industries for the use ofTHERMAL-XR®in their products, including on heat sinks for electronics. Figure 1 shows an aluminium heat sink that is commonly used in electronics for removing heat from printed circuit boards, electrical circuits and processing silicon chips, and that has been coated withTHERMAL-XR®.
Figure 1: THERMAL-XR® Coated Electronics Heat Sink
HEAT SINK MINIATURISATION:Third-party verified modelling demonstrates that applying THERMAL-XR® to a heat sink could reduce its size by up to 39%, while maintaining equivalent thermal performance, offering the potential for weight and material cost savings. Figure 2 shows that the maximum temperature reached by a heat sink coated with THERMAL-XR® is 62 degrees centigrade, 23% lower than the maximum temperature of 80 degrees Celsius reached by a heat sink of equal size that has not been coated with THERMAL-XR®. Figure 3 shows that a heat sink coated with THERMAL-XR® that is 39% smaller in terms of width achieves the same performance as a heat sink that has not been coated with THERMAL-XR®.
Material Ambient Temp. (˚C) Power (W) Emissivity Convection Type Heat Sink Dimensions (mm) Max Temp. (˚C) Temperature Difference Between Aluminium and THERMAL-XR® Width Length Height ΔT(˚C) ΔT% Aluminium 25 80 0.11 Natural Convection 62 58 38 80 -18 23% THERMAL-XR® 0.95 62 Figure 2: Modelling of an Electronic Heat Sink with THERMAL-XR® coated on all sides, excluding the base, shows a 23% reduction in maximum temperature reached.
Material Ambient Temp. (˚C) Power (W) Emissivity Convection Type No. of Fins Heat Sink Size (mm) Temperature (˚C) Width Length Height ΔW% Max Min Aluminium 25 80 0.11 Natural Convection 8 62 58 38 - 80 76.7 THERMAL-XR® 0.95 5 38 58 38 -39% 80 75 Figure 3: A heat sink coated with THERMAL-XR® on all sides, excluding the base, that is 39% smaller achieves the same results and temperature as the bare aluminium heat sink depicted in Figure 1.
Global Printed Circuit Board (PCB) production is projected[1]to reach 530 million square meters annually by the year 2030, or about 5.3 trillion printed circuit boards. As PCB density increases, higher current loads lead to more heat, with 5.2 billion units expected to require heat sinks for cooling. THERMAL-XR® coated on the heat sinks, enhances the heat sink efficiency, enabling smaller heat sinks and more compact PCB assemblies. The total amount of THERMAL-XR® that could be used for this application to improve performance is 26.5 million litres per annum by 2030, assuming 0.1% will use the coating.
GMG's Managing Director and CEO, Craig Nicol, commented: "Heat sinks are a critical component of modern electronics, but they come with various challenges, especially as devices become smaller, faster, and more powerful. GMG's THERMAL-XR® offers a potential solution in heat sink miniaturization, enabling up to 39% size reduction while maintaining thermal performance. This has the potential to not only cut material costs but also unlock new opportunities for compact and efficient electronics designs, addressing the rising thermal management demands of the global printed circuit board market."
About THERMAL-XR® powered by GMG Graphene:THERMAL-XR® COATING SYSTEM is a unique method of improving the thermal heat transfer of heat exchange surfaces. The process coats and protects heat exchange surfaces while increasing the heat transfer rate by leveraging the physics of GMG Graphene, resulting in an efficiency improvement and a potential power reduction.
THERMAL-XR® ispowered by GMG Graphene.PATENT PENDING
About GMGwww.graphenemg.comGMG is a clean-technology company which seeks to offer energy saving and energy storage solutions, enabled by graphene, including that manufactured in-house via a proprietary production process. GMG has developed a proprietary production process to decompose natural gas (i.e. methane) into its elements, carbon (as graphene), hydrogen and some residual hydrocarbon gases. This process produces high quality, low cost, scalable, 'tuneable' and low/no contaminant graphene suitable for use in clean-technology and other applications.
The Company's present focus is to de-risk and develop commercial scale-up capabilities, and secure market applications. In the energy savings segment, GMG has focused on graphene enhanced heating, ventilation and air conditioning ("HVAC-R") coating (or energy-saving coating), lubricants and fluids.
In the energy storage segment, GMG and the University of Queensland are working collaboratively with financial support from the Australian Government to progress R&D and commercialization of graphene aluminium-ion batteries ("G+AI Batteries").
GMG's 4 critical business objectives are:
- Produce Graphene and improve/scale cell production processes
- Build Revenue from Energy Savings Products
- Develop Next-Generation Battery
- Develop Supply Chain, Partners & Project Execution Capability
For further information please contact:
- Craig Nicol, Chief Executive Officer & Managing Director of the Company at[email protected], +61 415 445 223
- Leo Karabelas at Focus Communications Investor Relations,[email protected], +1 647 689 6041
[1] Areas of PCB production projected from the source, Prismark Printed Circuit Board Market Report 2021, page 13
Neither the TSX Venture Exchange nor its Regulation Services Provider (as that term is defined in the policies of the TSX Venture Exchange) accept responsibility for the adequacy or accuracy of this news release.
Cautionary Note Regarding Forward-Looking StatementsThis news release includes certain statements and information that may constitute forward-looking information within the meaning of applicable Canadian securities laws. Forward-looking statements relate to future events or future performance and reflect the expectations or beliefs of management of the Company regarding future events.
Such forward-looking statements are based on a number of assumptions of management, including, without limitation, that the Company will continue to receive interest in testing and buying THERMAL-XR® from multiple industries, that the use of THERMAL-XR® on heat sinks will result in the benefits expected by management, that the use of THERMAL-XR® will allow heat sinks to be smaller while delivering equivalent thermal performance, that PCB production will grow as currently projected, and that the number of PCBs requiring heat sinks in the future will align with current estimates.
